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SOLIDWORKS Flow Simulation: Electronics Cooling Module

SOLIDWORKS Flow Simulation: Electronics Cooling Module

Table of Contents


Thermal analysis of electronics is one of the most common applications for
SOLIDWORKS Flow Simulation. Flow Simulation’s user friendly approach to CFD
makes it easy to gain design insight and improve cooling performance. If you
currently use or are considering Flow Simulation for electronics cooling
analysis, you may be wondering, “Do I need the Electronics Cooling Module?”

SOLIDWORKS Flow Simulation is a versatile tool and can provide valuable
information for a wide range of electronics cooling scenarios without the
Electronics Cooling Module. However, the add-in extends the software’s ability
to accurately model specific situations with several enhancements. Let’s take
a look at what these situations look like without and with the Electronics
Cooling Module.

SOLIDWORKS Flow Simulation thermal results and flow trajectories inside an electronics enclosure
Airflow and component temperatures inside an electronics enclosure.

Printed Circuit Boards

Printed circuit boards are notable from a thermal standpoint because they
exhibit anisotropic material behavior. The layered structure results different
thermal conductivities within the plane and through the thickness of the
board.

Comparison table: defining PCB thermal conductivity without versus with the Electronics Cooling Module

Exploded view of a multilayer printed circuit board showing copper and dielectric layers
Layered PCB construction produces anisotropic thermal conductivity.

Chip Packages

Accurate thermal representation of chip packages is critical in an analysis,
as they are usually the main sources of heat. Creating true-to-life models of
components is very rarely feasible as packages are complex, involving many
different parts and materials, and internal details are not available from
chip manufacturers. Therefore, simplified models are used.

Comparison table: chip packages as lumped blocks versus two-resistor compact models with the Electronics Cooling Module

CPU chip package with integrated heat spreader on a circuit board
Two-resistor compact models capture both case and junction temperatures.

Heat Pipes

Heat pipes use the phase change properties of a working fluid to achieve very
high effective thermal conductivities.

Comparison table: modeling heat pipes without versus with the Electronics Cooling Module

Copper heat pipes and cooling fan inside a laptop
Heat pipes use phase change to reach very high effective conductivity.

 

Joule Heating

Heat is generated as electric current passes through a conductor. This is
commonly known as resistive heating or Joule heating.

Comparison table: calculating Joule heating manually versus automatically with the Electronics Cooling Module

Beyond these features, the add-in also includes an enriched engineering
database with a wide range of component, fan, and material information so that
you can spend less time sourcing information from manufacturers. It’s all
about convenience!

Hopefully this feature breakdown has helped you figure out whether or not the
Electronics Cooling Module will help you with your analyses. Check out
this video on our
YouTube channel to see the features in action.

And for more information:

Picture of Terence Woo

Terence Woo

Terence Woo is a product manager at our Hawk Ridge Systems office in Vancouver, British Columbia. He has extensive experience with SOLIDWORKS and SIMULIA analysis tools and has helped hundreds of customers solve problems across many industries. When he isn’t working on simulation models, he spends his free time skiing, golfing, rock climbing, and playing hockey.

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