Description
The Electronic Cooling Module enables designers and engineers to quickly and accurately model complex electronic systems for thermal analysis. With its combination of ease of use and industry specific tools, the Electronic Cooling Module ensures maximum analysis productivity with enhanced simulation fidelity.
SOLIDWORKS ELECTRONIC COOLING MODULE INCLUDES:
PCB THERMAL ANLAYSIS
Users can easily study the PCB in isolation allows the designer to evaluate component placement, use of heat pipes, thermal pads and interface materials.
ELECTRONIC MODEL LIBRARY
Users will have an extensive library of electronic models all within the SOLIDWORKS Flow platform
ROUTING ELECTRICAL COMPONENTS
Equipment designers, product designers, machine designers, facility designers and others all need rectangular section routing to complete their designs that include ducting, cable trays, conveyors, material handling chutes, and many other systems.
HEATSINK SELECTION/DESIGN
Correctly determine heatsink/heatsink design with the knowledge of overall airflow and thermal impacts of the components on the PCB in relation to the operational life of the component to be cooled.
PCB GENERATORS
Users can obtain the bi-axial thermal conductivity values automatically derived from the PCB structure and the properties of the specified conductor and dielectric materials and determine the physical properties of multi-layer PCB’s.
ELECTRICAL CONTACT ANALYSIS
Quickly design and electronic components within an electronic thermal model to accurately account for contact
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