PostProcess Support Removal Systems
PostProcess Support Removal solutions bring consistency and reliability to your 3D printed parts by automating your additive manufacturing support removal workflow.
Internal ID
MF0029-29-2-2-1
Bring Consistency, Reliability, and Speed to Your Support Removal Process
PostProcess offers support removal systems that are geared toward multiple additive technologies including FDM, SLA, PolyJet, CLIP, DLP and more. Controlled by their proprietary AUTOMAT3D software, you can optimize the equipment for your specific part needs using multiple recipes, agitation profiles, temperatures, and cycle times.
Both Submersed Vortex Cavitation (SVC) and Volumetric Velocity Dispersion (VDD) systems are available from PostProcess technologies. The main difference being that SVC is a submersive process while VDD is a spray process. While these machines can process multiple additive technologies, SVC is more suited for PolyJet and Resin based technologies and VDD is more suited for FDM technologies.
DEMI 200 |
DEMI 800 |
BASE |
DECI |
|
|---|---|---|---|---|
| Support Removal Technology |
Submersed Vortex Cavitation (SVC) |
Submersed Vortex Cavitation (SVC) |
Volumetric Velocity Dispersion (VDD) |
Volumetric Velocity Dispersion (VDD) |
| Chamber Size |
18” L x 10” W x 6” H (46 cm x 25 cm x 15 cm) |
18” L x 18” W x 18” H (46 cm x 46 cm x 46 cm) |
40” L x 27.5” W x 26” H (102 cm x 70 cm x 66 cm) |
19” L x 27.5” W x 26” H (48 cm x 70 cm x 66 cm) |
| Machine Footprint |
23.5” L x 18” W x 15.5” H (46 cm x 25 cm x 15 cm) |
34.75” L x 43.5” W x 59.75” H (88 cm x 110 cm x 152 cm) |
68.7” L x 40.7” W x 93.2” H (174 cm x 103 cm x 238 cm) |
44.7” L x 40.4” W x 93.8” H (114 cm x 103 cm x 238 cm) |
| Consumables |
Polyjet Materials: PLM-101-SUB; SLA, DLP, and CLIP Materials: PLM-403-SUB; FDM Materials: PLM-201-SUB |
Polyjet Materials: PLM-101-SUB; SLA, DLP, and CLIP Materials: PLM-403-SUB; FDM Materials: PLM-201-SUB |
Polyjet Materials: PLM-101-SPRAY; FDM Materials: PLM-201-SPRAY; Anti Foaming Agent: AUX-001-DEFOAM (optional) |
Polyjet Materials: PLM-101-SPRAY; FDM Materials: PLM-201-SPRAY; Anti Foaming Agent: AUX-001-DEFOAM (optional) |
| Weight |
35 lbs. empty; 75 lbs. full |
700 lbs. empty; 1000 lbs. full |
1500 lbs. empty; 2000 lbs. full |
1200 lbs. empty; 1370 lbs. full |
| Power Requirements |
120 1-Phase 8.5A |
120 1-Phase 20A |
208V 3-Phase 50A |
208V 3-Phase 35A |
| Software |
AUTOMAT3D |
AUTOMAT3D |
AUTOMAT3D |
AUTOMAT3D |
SERVICES
MORE THAN JUST A PROVIDER
The Hawk Ridge team is here to help you succeed. From implementation to mentoring and consulting, we offer a full range of professional services to dig in and help solve your biggest design challenges.
TRAINING
IMPROVE PERFORMANCE THROUGH TAILORED LEARNING
We offer training pathways for every schedule and learning style including online, in-person, and on-demand content. Whether you learn best in a classroom or would rather sit on your couch with a coffee in hand, there's a training method for you.
SUPPORT
TOP-RANKED SUPPORT, COMMITTED TO YOUR SUCCESS
We have the sharpest, friendliest support team in the industry, hands down. Whether you need help troubleshooting a small design issue or want to dig into a complex challenge or best practices with an expert, we are here for you – and we love a good challenge.
FREQUENTLY ASKED QUESTIONS
What types of 3D printed parts can
PostProcess systems remove support from?
PostProcess machines can accomplish support removal for many common 3D
printing methods including MJF, SLS, FDM, SLA, CLIP, PolyJet, and more.
Which machines are more suited for
FDM parts?
Any machine that uses Volumetric Velocity Dispersion (VDD) is going to be
better for FDM parts. One reason is because the processing times are
significantly faster with VDD equipment due to faster drying times. The
BASE and DECI are both great options for FDM.
Which machines are more suited for
resin-based printing technologies?
Machines that use Submersed Vortex Cavitation (SVC) like the DEMI 200 or
DEMI 800 are more suited for resin technologies such as SLA or PolyJet.
YOU'VE GOT QUESTIONS, WE'VE GOT ANSWERS
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